Rigid PCB |
||
|---|---|---|
| Layer | 1~64 | |
| Max. Board Size | 1092 x 660.4mm | |
| Max. Board Thickness | 10mm | |
| Min. Board Thickness | 0.304mm | |
| Min. Core Thickness | 0.038mm | |
| Max. Final Copper Thickness | Inner layer | 12OZ |
| Outer layer | 12OZ | |
| Min. Line Width/Space | 0.05/0.05mm | |
| Min. CNC Drilling Size | 0.1mm | |
| Min. Laser Drilling Size | 0.075mm | |
| Min. PAD | Inner layer | 0.14mm |
| Outer layer | 0.15mm | |
| Min. Distance between Via edge to edge | 0.23mm | |
| Min. Distance between Via to Line | 0.15mm | |
| Aspect Ratio | 18:1 | |
| Impedance Tolerance Control | ±5% | |
| HDI Ability | 5+N+5 | |
| Heat Sink | Mass Production | |
| Embedded Capacitance | Mass Production | |
| Embedded Resistance | Mass Production | |
| Surface Treatment |
ENIG, Flash Gold, HASL/HASL Lead free, OSP, Immersion Tin, Immersion Silver, Plating Sn-Cu |
|
HDI |
||
|---|---|---|
| Min. Line Width / Space um | 40/40 | |
| Max. Layer Count | 30 | |
| Min. Board Thickness mm | 0.1 | |
| Min. CCL Thickness um | 40 | |
| Min. Build-up Thickness um | 40 | |
| Min. Microvia/Land PAD Design um | 75/225 | |
| Max. Microvia/Land PAD Design um | 400/600 | |
| Max. Buried Holes Aspect Ratio | 1:1 | |
Rigid – Flex PCB |
||
|---|---|---|
| Material | Flex | Adhesive/Adhesiveless FCCL, PET |
| Rigid | Middle, High TG, Lead/Halogen Free, PI, High frequency | |
| Low flow | Epoxy adhesive series, Acrylic adhesive series | |
| Coverlay | Epoxy adhesive series, Acrylic adhesive series | |
| Layers | Max. | 10R+16F+10R |
| Min. | 1R+1F | |
| Finished thickness | Thickness | Min 0.4mm |
| Tolerance | Min ±0.05mm | |
| Copper thickness | Inner layer | 1/2-2OZ |
| Outer layer | 1/2-2OZ | |
| Finished size | Min. | Min 50mm*50mm |
| Max. | Max 500mm*1000mm | |
| Min. Line width/Space | Inner layer | 0.05/0.05mm |
| Outer layer | 0.05/0.05mm | |
| Finished Drilling | CNC drill | Min ￠0.15mm |
| Laser drill | Min ￠0.05mm | |
| Aspect Ratio | Laser drill | Max 1.2:1 |
| CNC drill | Max 18:1 | |
| Dielectric Thickness | Flex | Min 0.0125mm |
| Rigid | Min 0.05mm | |
| HDI Ability | Any layer | |
| Surface Treatment |
ENIG, Flash Gold, HASL/HASL Lead free, OSP, Immersion Tin, ENEPIG, Immersion Silver |
|
Flex PCB |
||
|---|---|---|
| Material | FCCL | Adhesive/Adhesiveless FCCL, PET |
| Stiffener | PI, FR4, Steel, Al-Based Stiffener | |
| Adhesive sheet | Epoxy adhesive series, Acrylic adhesive series | |
| Coverlay | Epoxy adhesive series, Acrylic adhesive series | |
| Layers | FPC | 10 |
| Finished thickness | Thickness | Min 0.05mm |
| Tolerance | Min ±0.03mm | |
| Copper thickness | Inner layer | 1/3-1OZ |
| Outer layer | 1/3-2OZ | |
| Finished size | Min. | Min 5mm*5mm |
| Max. | Max 500mm*1000mm | |
| Min. Line width/Space | Inner layer | 0.05/0.05mm |
| Outer layer | 0.05/0.05mm | |
| Finished Drilling | CNC drill | Min 0.15mm |
| Laser drill | Min 0.05mm | |
| Aspect Ratio | CNC drill | Max 1.2:1 |
| Laser drill | Max 18:1 | |
| Dielectric Thickness | FCCL | Min 0.0125mm |
| Routing Tolerance | Laser routing | +/-0.05mm |
| Punching | Min 0.05mm | |
| Surface Treatment |
ENIG, Flash Gold, HASL/HASL Lead free, OSP, Immersion Tin, ENEPIG, Immersion Silver, Plating Sn-Cu |
|
Aluminum |
||
|---|---|---|
| Base Material | Copper Base MCPCB / Aluminum Base MCPCB | |
| Max. Layer Count | 2 (One Side) | |
| Max Board Thickness mm | 3.2mm | |
| Max Copper Thickness | 4Oz | |
| Max Board size | 546 x 1230mm | |
| Surface Finish | LF HASL, ENIG, OSP, Immersion Tin, ENEPIG | |
| Thermal Conductivity | Up to 390W/m Degree | |